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Boron (B) sputtering targets, Purity: 99.9%, CAS ID: 7440-42-8picture1

Boron (B) sputtering targets, Purity: 99.9%, CAS ID: 7440-42-8

USD $200.00 / piece 1piece (MOQ)
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Product Details

Boron (B) amorphous, CAS ID: 7440-42-8 product list from TYR as following:

Boron, B Sputtering targets:

 

purity: 99.9%

Size: max. 355.6mm (14 inch) , Length: 250mm x Width 200mm x thickness 20mm max.,

Shape: Discs, disks, step disk, delta, plate, sheets or made per drawing
 


The melting point of boron is 2079oC, its boiling point is at 4000oC, the specific gravity of crystalline boron is 2.34g/cm3, the specific gravity of the amorphous form is 2.37g/cm3, Crystalline boron is hard, brittle, lustrous black semimetal. Amorphous boron is a brown powder.

Boron is a non-metallic element and the only non-metal of the group 13 of the periodic table the elements. The Boron are borderline between metals and non-metals (semimetallic). It is a semiconductor rather than a metallic conductor. Chemically it is closer to silicon than to aluminium, gallium, indium, and thallium.
At standard temperatures boron is a poor electrical conductor but is a good conductor at high temperatures.

Applications:
1. Glass and ceramics
2. Detergent formulations and bleaching agents
3. Semiconductors, Boron are a useful dopant for such semiconductors as silicon, germanium, and silicon carbide. Having one fewer valence electron than the host atom, it donates a hole resulting in p-type conductivity. Traditional method of introducing boron into semiconductors is via its atomic diffusion at high temperatures.
4. Magnets
5. High-hardness and abrasive compounds
6. Amorphous boron is used as a melting point depressant in nickel-chromium braze alloys.
Hexagonal boron nitride forms atomically thin layers, which have been used to enhance the electron mobility in grapheme devices. It also forms nanotubular structures (BNNTs), which have with high strength, high chemical stability, and high thermal conductivity, among its list of desirable properties

 

We also supply below material:

 

Material Name

FormulaPurity
AluminumAl99.99%, 99.999%
AntimonySb99.99%, 99.999%
BoronB99.9%,99.99%, 99.999%
BariumBa99.3%, 99.9%, 99.95%
BismuthBi99.99%, 99.999%
GraphiteC99.99%
CobaltCo99.9%, 99.95%, 99.99%
ChromiumCr99.5%, 99.9%, 99.95%
CopperCu99.99%, 99.999%
CadmiumCd99.99%
IronFe99.9%, 99.99%
IndiumIn99.9%, 99.99%,99.999%
LithiumLi99.5%
MolybdenumMo99.95%
MagnesiumMg99.95%
NickelNi99.9%, 99.98%, 99.995%, 99.999%
NiobiumNb99.95%
LeadPb99.99%
RheniumRe99.95%, 99.99%
SiliconSi99.999%, 99.9999%,poly or mono crystal, doped or undoped
SeleniumSe99.99%, 99.999%
TelluriumTe99.99%,99.999%
TantalumTa99.95%, 99.99%
TitaniumTi99.7%, 99.99%, 99.995%, 99.999%
TinSn99.99%, 99.999%
TungstenW99.95%
VanadiumV99.9%

 

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